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Nov/Dec 2015 SAMPE Journal Cleaner Surface Preparation for Bonding Using CO2 Technology
Bonding processes by any method and for any purpose permit the utilization of new engineered materials in combination with tranformative design concepts. Appropriate surface preparation is the essential first step to provide consistent and reliable adhesive or cohesive bond strenght. Conventional surface treatment options for joining substrates pose different constraints in terms cost of ownership, environmental compliance, and performance. Carbon dioxide (CO2) based processing alternatives offer an effective, eco-friendly and robust platform for preparing many types of substrates surfaces for numerous medical, aerospace, automobile, opthalmic and microelectronic bonding applications.